doc. no : qw0905-la38b-76/h-pf rev : a date : 05 - apr. - 2006 data sheet ligitek electronics co.,ltd. property of ligitek only led array la38b-76/h-pf lead-free parts pb
+ - note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lh3330-pf part no. la38b-76/h-pf page 1/5 package dimensions ligitek electronics co.,ltd. property of ligitek only 0.5 typ 1.0min 1.5max 25.0min 1.0min 2.54typ - + 0.5 typ 5.9 5.0 8.6 7.6 2.54typ 7.6 8.6 18.6 0.5 10 5.2 5.9 5.0
symbol i fp pd i f t opr ir tstg color red diffused typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 storage temperature gap la38b-76/h-pf red material part no emitted forward current reverse current @5v operating temperature power dissipation peak forward current duty 1/10@10khz parameter -40 ~ +100 4.5 697902.6 1.73.036 typ. luminous intensity @10ma(mcd) forward voltage @ ma(v) spectral halfwidth nm peak wave length pnm lensmax. min.min. 20 viewing angle 2 1/2 (deg) page2/5 15 ma -40 ~ +85 10 40 60 a ma mw ratings h unit ligitek electronics co.,ltd. property of ligitek only part no. la38b-76/h-pf
r e l a t i v e i n t e n s i t y @ 2 0 m a 600 0.0 0.5 wavelength (nm) 700800900 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 1.0 10 1000 h chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward voltage(v) 2.03.04.05.01.0 0.0 1.5 1.0 0.5 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 1000 3/5 page part no. la38b-76/h-pf
0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to case) ligitek electronics co.,ltd. property of ligitek only page 4/5 60 seconds max part no. la38b-76/h-pf
mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to see soldering well performed or not. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. thermal shock test solder resistance test high temperature high humidity test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. 5/5 page mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test condition test item reliability test: description reference standard ligitek electronics co.,ltd. property of ligitek only part no. la38b-76/h-pf
|
